Sign In | Join Free | My frbiz.com
frbiz.com
Products
Search by Category
Home > Digital Camera >

VOx High Resolution Thermal Camera Module Uncooled LWIR 1280x1024 / 12μm

Categories Infrared Thermal Camera Module
Brand Name: GST
Model Number: PLUG1212R
Certification: ISO9001:2015; RoHS; Reach
Place of Origin: Wuhan, Hubei Province, China
MOQ: 1 Piece
Price: Negotiable
Payment Terms: L/C, T/T
Resolution: 1280x1024/12μm
NETD: <50mK
Spectral Range: 8~14μm
Size: 20x20x10.4mm
  • Haven't found right suppliers
  • Our buyer assistants can help you find the most suitable, 100% reliable suppliers from China.
  • And this service is free of charge.
  • we have buyer assistants who speak English, French, Spanish......and we are ready to help you anytime!
Submit Buying Request
  • Product Details
  • Company Profile

VOx High Resolution Thermal Camera Module Uncooled LWIR 1280x1024 / 12μm

PLUG1212 Infrared Camera Module

VOx Uncooled LWIR 1280x1024 / 12μm Thermal Camera Module for Industrial Temperature Measurement


Product Description

PLUG1212R is one of the PLUG-R series uncooled infrared camera module developed by Global Sensor Technology (GST). It adopts the market preferred focal plane array VOx microbolometer uncooled infrared detector, professional signal processing circuit and image processing platform, completely transforms the target infrared radiation into temperature data. Its temperature measurement is available and temperature range can be customizable raging from -20℃~150 ℃ for industrial temperature measurement.


With large array 1280x1024 resolution, the PLUG1212R uncooled thermal module could present more image details and supports larger field of view. The reduced 12µm pixel size offer better spatial resolution and match shorter optical lens focus to achieve the same range mission.


Main Features

- Pixel pitch: 12μm

- Resolution: 1280x1024

- Spectra Range: 8μm -14μm

- High Sensitivity: NETD<30mK

- Temperature Range: -20℃~150℃, 100℃~550℃

- Temperature Accuracy: ±2℃ or ±2%

- High reliability & Strong Environmental Adaptability.


Product Specifications

ModelPLUG1212R
IR Detector Performance
Resolution1280x1024
Pixel Pitch12μm
Spectral Range8~14μm
NETD<30mk
Image Processing
Frame Rate25Hz
Start-up Time<25s
Analog Video/
Digital VideoHDMI/RAW/YUV/BT1120
Extension ComponentUSB/Camerlink
Dimming ModeLinear/Histogram/Mixed
Digital Zoom1~8X Continual Zoom, Step Size 1/8
Image DisplayBlack Hot/White Hot/Pseudo Color
Image DirectionHorizontally/Vertically/Diagonally Flip
Image AlgorithmNUC/AGC/IDE
Electrical Specification
Standard External Interface50pin_HRS Interface
Communication ModeRS232-TTL, 115200bps
Supply Voltage5±0.5V
Temperature Measurement
Operating Temperature Range-10°C~50°C
Temperature Range-20°C~150°C, 100°C~550°C
Temperature Accuracy±2°C or ±2% (Take the Maximum Value)
SDKARM/Windows/Linux SDK, Full Screen Thermography
Physical Characteristics
Dimension (mm)56x56x40.2
Weight≤200g
Environmental Adaptation
Operation Temperature-40°C ~ +70°C
Storage Temperature-45°C ~ +85°C
Humidity5%~95%, Non-condensing
VibrationRandom Vibration 5.35grms, 3 Axis
ShockHalf-sine Wave, 40g/11ms, 3 Axis 6 Direction
Optics
Optional LensFixed Focus Athermal: 19mm/25mm

Industrial Applications

The PLU1212R infrared imaging module is widely used in Power Electricity, Machine Vision, Building Inspection, Metallurgical Petrochemical etc.


Our Core Infrared Detectors


FAQs

1. About ceramic packaging infrared detector

Ceramic packaging process is similar to metal packaging, which is a mature infrared detector packaging technology. Compared with metal packaging, the volume and weight of the packaged detector will be greatly reduced. For ceramic packaging, its readout circuit has self-adjusting operating temperature function and does not require TEC stabilization.


2. Wafer Level Packaging

Wafer-level packaging, also known as wafer-level size packaging, has become an important part of advanced packaging technology in the semiconductor industry. Wafer level packaging (WLP) is the process of completing high vacuum packaging directly on the entire MEMS wafer, then scribing and cutting to make a single infrared detector. It performs most or all of the packaging and testing procedures directly on the IR detector wafer before dicing.

It is an improved chip size package that meets the needs of small size, lightweight, portable, handheld, low price and high production efficiency.

Quality VOx High Resolution Thermal Camera Module Uncooled LWIR 1280x1024 / 12μm for sale
Send your message to this supplier
 
*From:
*To: WUHAN GLOBAL SENSOR TECHNOLOGY CO., LTD.
*Subject:
*Message:
Characters Remaining: (0/3000)
 
Inquiry Cart 0