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Rogers RO4534 High Frequency Printed Circuit Board 20mil 30mil 60mil Antenna PCB With Immersion Gold and Immersion Tin

Categories Rogers PCB Board
Brand Name: Bicheng
Model Number: BIC-187.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Base material: Ceramic-filled, Glass-reinforced Hydrocarbon
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
PCB thickness: 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm )
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..
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Rogers RO4534 High Frequency Printed Circuit Board 20mil 30mil 60mil Antenna PCB With Immersion Gold and Immersion Tin


Rogers RO4534 High Frequency Printed Circuit Board 20mil 30mil 60mil Antenna PCB With Immersion Gold and Immersion Tin

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


General Description

RO4534 High Frequency Laminates are ceramic-filled, glass-reinforced hydrocarbon based material which are cost/performance materials from Rogers Corporation, specifically engineered and manufactured to meet the specific demands of the antenna markets. It has a dielectric constant of 3.4 and a loss tangent (Df) of 0.0027 measured at 10 GHz. These values allow antenna designers to realize substantial gain values while minimizing signal loss. Thus, it provides excellent passive intermodulation response required for mobile infrastructure microstrip antenna applications.


As a cost-effective replacement for more established PTFE antenna technology, it enables our designers to balance the cost and performance of the antennas. The resin systems of RO4534 dielectric materials are created to offer the appropriate antenna performance-related features. In both the X and Y directions, the coefficients of thermal expansion (CTEs) are comparable to those of copper. The printed circuit board antenna is less stressed because to a good CTE fit.


Features and Benefits

1. Low Loss 0.0027 , Low Dk 3.4, low PIM response: Wide range of application use

2. Thermoset resin system: Compatible with standard PCB fabrication

3. Excellent dimensional stability: Greater yield on larger panels sizes

4. Uniform mechanical properties: Maintains mechanical form during handling

5. High thermal conductivity: Improved power handling


Typical Applications:

1. Cellular infrastructure base station antennas

2. WiMAX antenna networks


Our PCB Capability (RO4534)

PCB Material:Ceramic-filled, Glass-reinforced Hydrocarbon
Designation:RO4534
Dielectric constant:3.4
Dissipation Factor0.0027 10GHz
Layer count:Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm )
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..

RO4534 Typical Values

PropertyRO4534DirectionUnitsConditionTest Method
Dielectric Constant, er Process3.4 ± 0.08Z-10 GHz/23 2.5 GHzIPC-TM-650,2.5.5.5
Dissipation Factor0.0022Z-2.5 GHz/23IPC-TM-650, 2.5.5.5
0.002710 GHz/23
PIM (Typical)-157-dBcReflected 43 dBm swept tonesSummitek 1900b PIM Analyzer
Dielectric Strength>500ZV/mil0.51 mmIPC-TM-650, 2.5.6.2
Dimensional Stability<0.3X,Ymm/m (mils/inch)after etchIPC-TM-650, 2.4.39A
Coefficient of Thermal Expansion11Xppm/-55 to 288IPC-TM-650, 2.4.41
14Y
46Z
Thermal Conductivity0.6-W/(m.K)80ASTM C518
Moisture Absorption0.06-%D48/50IPC-TM-650, 2.6.2.1 ASTM D570
Tg>280- TMAAIPC-TM-650, 2.4.24.3
Density1.8-gm/cm3-ASTM D792
Copper Peel Strength6.3 (1.1)-lbs/in (N/mm)1 oz. EDC post solder floatIPC-TM-650, 2.4.8
FlammabilityNON FR---UL 94
Lead-Free Process CompatibleYes----


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