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​0.80MM Thickness Printed Circuit Board Assembly Services FR-4 TG140 Material 10 Layers

​0.80MM Thickness Printed Circuit Board Assembly Services FR-4 TG140 Material 10 Layers

​0.80MM Thickness Printed Circuit Board Assembly Services FR-4 TG140 Material 10 Layers
​0.80MM Thickness Printed Circuit Board Assembly Services FR-4 TG140 Material 10 Layers
Categories PCB Assembly Services
Brand Name: China chao sheng
Model Number: CSPCB1514
Certification: ISO/UL/RoHS/TS
Place of Origin: Shenzhen, Guangdong, China
MOQ: 1PCS
Price: USD1.0/pcs
Payment Terms: T/T, Western Union
Supply Ability: 500000pcs per month
Delivery Time: 15-18day
Packaging Details: Anti-static bag + Anti-static bubble wrap + Good quality carton box
Base Material: FR-4 TG140
Board Thickness: 0.80MM
Min. Line Spacing: 3 Mil (0.075 Mm)
Copper Thickness: 1/1/1/1/1/1/1/1OZ
Products Product Structure: 10layers
Minimum Hole: 0.20mm
Minimum Line Width And Space: 4/3mil
Impedance Value: ±10%
Surface Treatment: Immersion Gold, Electro-nickel Gold, Immersion Tin, OSP, Lead-free Spray Tin
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Company Info.
Shenzhen Chaosheng Electronic Technology Co.,Ltd
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​0.80MM Thickness Printed Circuit Board Assembly Services FR-4 TG140 Material 10 Layers

10 layers ​ FR-4, TG140 Seeed Fusion PCB Specification Panelization and Bridge Design

Component Layout Considerations PCB Hole design Solder Mask Design Copper Trace Design

PCB Lamination Structure

  1. Printed circuit board (pcb) and PCBA products
    Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
    Flexible circuit board (FPC) and FPCA product areas
    CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.

Quick Details

  • Surface Finishing: gold plating
  • Min. Line Spacing: 0.11mm
  • Min. Line Width: 0.11mm
  • Min. Hole Size: 0.25mm
  • Board Thickness: 1.0mm
  • Copper Thickness: 1oz
  • Base Material: FR4
  • Model Number: 14
  • Brand Name: XHPCB

Specifications


6 layer gold plating PCB multilayer PCB


Packaging Details:vacuum and carton
Delivery Detail:5-15workdays

XHPCB was established in 2006, located in ShenZhen of China,occupy 3000 square meters, there are 200 employees,10 engineers.

we engaged in all kinds of PCB design, manufacture services over tenyears, we are a ODM and OEM factory,

Main for Single-Sided Board, Double-Sided Board, Multilayer Board,Blind via Multilayer board, Buried via multilayer board, and so on.

PCB specification: conductor line/space≧0.01mm, holediameter≧0.2mm, layer quantity≦8

Surface treatment: HASL(lead free) ,HASL(with lead), immersion gold,immersion silver,gold plated ,OSP and so on.

Usage: electronic products, Digital product, LED, auto, communication,Medical,home appliance, computers, consumption goods and so on.

Medical,home appliance, computers, consumption goods and so on.

1: Medical Bluetooth module motherboard
2: Halogen-free FR-4 TG180, inner and outer copper thickness 35um, minimum line width line spacing 3/3mil, hole ratio 10:1, minimum hole 0.10mm, blind hole buried hole, immersion gold, red solder resist, white
3: The board thickness is 1.60mm,
4: blind hole, resin plug hole + plating hole
Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB
Standard.
Quantities range from prototype to volume production.
100% E-Test

FAQ:

Q: What files do you use in PCB fabrication?

A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position

Q: Is it possible you could offer sample?

A: Yes, we can custom you sample to test before mass production

Q: When will I get the quotation after sent Gerber, BOM and test procedure?

A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.

Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?

A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing

Q: How can I make sure the quality of my PCB?

A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

PCB, FPC process production capability

1: Medical Bluetooth module motherboard
2: Halogen-free FR-4 TG180, inner and outer copper thickness 35um, minimum line width line spacing 3/3mil, hole ratio 10:1, minimum hole 0.10mm, blind hole buried hole, immersion gold, red solder resist, white
3: The board thickness is 1.60mm,
4: blind hole, resin plug hole + plating hole
Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB
Standard.
Quantities range from prototype to volume production.
100% E-Test

FAQ:

Q: What files do you use in PCB fabrication?

A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position

Q: Is it possible you could offer sample?

A: Yes, we can custom you sample to test before mass production

Q: When will I get the quotation after sent Gerber, BOM and test procedure?

A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.

Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?

A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing

Q: How can I make sure the quality of my PCB?

A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

PCB, FPC process production capability

Technical ltemMassProductAdvanced Technology
201620172018
Max.Layer Count26L36L80L
Through-hole plate2～45L2～60L2～80L
Max.PCBSize(in)24*52"25*62"25*78.75"
The layer number of FPC1～36L1～50L1～60L
Max.PCBSize(in)9.8"*196"9.8"*196"10"*196"Reel to reel
Layeredplatelayer2～12L2～18L2～26L
Max.PCBSize(in)9"*48"9"*52"9"*62"
Combination of hard and soft layers3～26L3～30L3～50L
Interconnect HDI5+X+5Interconnect HDI7+X+7Interconnect HDI8+X+8,Interconnect HDI
HDI PCB4～45L4～60L4～80L
Interconnect HDI3+20+34+X+4Interconnect HDI4+X+4,Interconnect HDI
Max.PCBSize(in)24"*43"24"*49"25"*52"
MaterialFR-4 RogersFR-4 RogersFR-4 Rogers
Base materialHalogenfree,LowDKHalogenfree,LowDKHalogenfree,LowDK
Build-up MaterialFR-4FR-4FR-4
BOard,Thickness(mm)Min.12L(mm)0.430.42～8.0mm0.38～10.0mm
Min.16L(mm)0.531.60～8.0mm0.45～10.0mm
Min.18L(mm)0.632.0～8.00.51～10.0mm
Min.52L(mm)0.82.50～8.0mm0.65～10.0mm
MAX(mm)3.510.0mm10.0mm
Min.CoreThickness um(mil)254"(10.0)254"(10.0)0.10～254(10.0mm)
Min.Build up Dielectric38(1.5)32(1.3)25(1.0)
BaseCopperWeightInner Layer4/1-8 OZ4/1-15 OZ4/1-0.30mm
Out Layer4/1-10 OZ4/1-15 OZ4/1-30 OZ
Gold thick1～40u"1～60u"1～120u"
Nithick76～127u"76～200u"1～250u"
Min.HOle/Land um(mil)150/300(6/12)100/200(4/8)100/200(4/8)
Min.Laser via/landum(mil)60/170(2.4/6.8)50/150(2/6)50/150(2/6)
Min. IVH,Hole size/landum(mil)150/300(6/12)100/200(4/8)100/200(4/8)
DieletricThickness38(1.5)32(1.3)32(1.3)
125(5)125(5)125(5)
SKipviaYesYesYes
viaoNhie(laserviaon BuriedPTH)YesYesYes
Laser Hole FillingYesYesYes
TechnicalltemMass ProductAdvanced Technolgy
2017year2018year2019year
Drill hole depth ratioThroughHole2017year.40:1.40:1
Aspet RatioMicro Via.35:11.2:11.2:1
Copper Filling Dimple Size um(Mil)10(0.4)10(0.4)10(0.4)
Min.LineWidth＆spacelnner Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
Plated Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
BGAPitch mm(Mil)0.30.30.3
Min.PTH Hole ring um(mil)75(3mil)62.5(2.5mil)62.5(2.5mil)
Line Width Control∠2.5MIL±0.50±0.50±0.50
2.5Mil≤L/W∠4mil±0.50±0.50±0.50
≦3mil±0.60±0.60±0.60
Laminated structureLayer by layer3+N+34+N+45+N+5
Sequential Build-up20L Any Layer36L Any Layer52L Any Layer
Multi-layer overlayN+NN+NN+N
N+X+NN+X+NN+X+N
sequential Lamination2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
Soft and hard bonding2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
PTH filling processPTH resin plug hole + plating fill
Electroplated hole/copper plug hole		PTH resin plug hole + plating fill
Electroplated hole/copper plug hole		PTH resin plug hole + plating fill
Electroplated hole/copper plug hole

Technical ltemMassProductAdvanced Technology
201620172018
Max.Layer Count26L36L80L
Through-hole plate2～45L2～60L2～80L
Max.PCBSize(in)24*52"25*62"25*78.75"
The layer number of FPC1～36L1～50L1～60L
Max.PCBSize(in)9.8"*196"9.8"*196"10"*196"Reel to reel
Layeredplatelayer2～12L2～18L2～26L
Max.PCBSize(in)9"*48"9"*52"9"*62"
Combination of hard and soft layers3～26L3～30L3～50L
Interconnect HDI5+X+5Interconnect HDI7+X+7Interconnect HDI8+X+8,Interconnect HDI
HDI PCB4～45L4～60L4～80L
Interconnect HDI3+20+34+X+4Interconnect HDI4+X+4,Interconnect HDI
Max.PCBSize(in)24"*43"24"*49"25"*52"
MaterialFR-4 RogersFR-4 RogersFR-4 Rogers
Base materialHalogenfree,LowDKHalogenfree,LowDKHalogenfree,LowDK
Build-up MaterialFR-4FR-4FR-4
BOard,Thickness(mm)Min.12L(mm)0.430.42～8.0mm0.38～10.0mm
Min.16L(mm)0.531.60～8.0mm0.45～10.0mm
Min.18L(mm)0.632.0～8.00.51～10.0mm
Min.52L(mm)0.82.50～8.0mm0.65～10.0mm
MAX(mm)3.510.0mm10.0mm
Min.CoreThickness um(mil)254"(10.0)254"(10.0)0.10～254(10.0mm)
Min.Build up Dielectric38(1.5)32(1.3)25(1.0)
BaseCopperWeightInner Layer4/1-8 OZ4/1-15 OZ4/1-0.30mm
Out Layer4/1-10 OZ4/1-15 OZ4/1-30 OZ
Gold thick1～40u"1～60u"1～120u"
Nithick76～127u"76～200u"1～250u"
Min.HOle/Land um(mil)150/300(6/12)100/200(4/8)100/200(4/8)
Min.Laser via/landum(mil)60/170(2.4/6.8)50/150(2/6)50/150(2/6)
Min. IVH,Hole size/landum(mil)150/300(6/12)100/200(4/8)100/200(4/8)
DieletricThickness38(1.5)32(1.3)32(1.3)
125(5)125(5)125(5)
SKipviaYesYesYes
viaoNhie(laserviaon BuriedPTH)YesYesYes
Laser Hole FillingYesYesYes
TechnicalltemMass ProductAdvanced Technolgy
2017year2018year2019year
Drill hole depth ratioThroughHole2017year.40:1.40:1
Aspet RatioMicro Via.35:11.2:11.2:1
Copper Filling Dimple Size um(Mil)10(0.4)10(0.4)10(0.4)
Min.LineWidth＆spacelnner Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
Plated Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
BGAPitch mm(Mil)0.30.30.3
Min.PTH Hole ring um(mil)75(3mil)62.5(2.5mil)62.5(2.5mil)
Line Width Control∠2.5MIL±0.50±0.50±0.50
2.5Mil≤L/W∠4mil±0.50±0.50±0.50
≦3mil±0.60±0.60±0.60
Laminated structureLayer by layer3+N+34+N+45+N+5
Sequential Build-up20L Any Layer36L Any Layer52L Any Layer
Multi-layer overlayN+NN+NN+N
N+X+NN+X+NN+X+N
sequential Lamination2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
Soft and hard bonding2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
PTH filling processPTH resin plug hole + plating fill
Electroplated hole/copper plug hole		PTH resin plug hole + plating fill
Electroplated hole/copper plug hole		PTH resin plug hole + plating fill
Electroplated hole/copper plug hole

Product Tags:

electronic assembly services

  

electronic pcb assembly

  
Quality ​0.80MM Thickness Printed Circuit Board Assembly Services FR-4 TG140 Material 10 Layers for sale

​0.80MM Thickness Printed Circuit Board Assembly Services FR-4 TG140 Material 10 Layers

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