4 Layer BGA Immerison Gold PCB In 0.8mm / Car Audio Amplifier Circuit Board

FR4 4 Layer BGA Immerison Gold PCB Board In 0.8mm With Black Soldermask White Silkscreen Car Audio Amplifier Circuit

Quick detail:

Specification:

Electronic Scale PCB With 0.8mm Thickness 94V0 Electronic Board Green Soldermask White Silkscreen,

FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and inner core is an important base material in production of multilayer printed circuit board,This kind of product is mainly used for double-sided PCB, dosage is very large. Epoxy glass fiber cloth substrate, the most widely used model for FR - 4, in recent years because of the electronic product installation technology and PCB technology development needs, appeared high Tg FR - 4 products.

BGA's full name Ball Grid Array (solder ball array package), which is in the bottom of the package substrate array solder ball as the circuit I / O terminals and printed circuit board (PCB) interconnection. The device using this technology is a surface mount device package.

PBG (Plastic Ball Grid Array), which uses BT resin / glass laminate as the substrate, plastic (epoxy molding compound) as the sealing material, solder ball can be divided into lead solder (63Sn37Pb, 62Sn36Pb2Ag) and lead-free solder Sn96.5Ag3Cu0.5), solder ball and package connections do not require additional use of solder.

Parameter:

Immersion Gold and the difference between gold-plated plate 1, immersion gold and gold-plated crystal structure is not the same as the thickness of gold for gold than gold-plated lot of gold will be gold-plated gold is more yellow, more satisfied customers. 2, immersion gold and gold-plated crystal structure is not the same, Shen Jin is easier than gold-plated welding, will not cause poor welding, causing customer complaints. Immersion gold plate of the stress more easily controlled, there is a bonding of products, more conducive to the processing of bonding. But also because of the gold than the gold-plated soft, so Shen Jin-board do not wear gold finger. 3, immersion gold plate only nickel gold pads, skin effect of the signal transmission is in the copper layer will not affect the signal. 4, immersion gold than gold-plated crystal structure is more compact, not easy to produce oxidation. 5, with the wiring more and more dense, line width, spacing has come to 3-4MIL. Gold is easy to produce gold short-circuit. Immersion gold plate only nickel gold on the pad, it will not produce gold short-circuit. 6, immersion gold plate only nickel gold on the pad, so the resistance of the line with the combination of copper layer is more solid. Engineering will not compensate for the spacing of the impact. 7, generally used for the relatively high requirements of the board, flatness is better, generally use immersion gold, immersion gold generally do not appear after the assembly of the black pad phenomenon. Immersion gold plate flatness and standby life as good as gold-plated plate

Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards.

We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,line amplifier,base station,RF antena,4G antena so on and so forth. Our company's sufficient stocks of hi-frequency pcb materials such as Rogers,TACONIC,Arlon,Isola,F4B,TP-2,FR-4 (dielectric rage:2.2-16) mainly used in the area of high technologies like communication device,Electronics,Aerospace,Military industry to meet our worldwide customers with high quality. Furthermore,we also keen on helping customers shorten the period of production development and 24 hours of sample service is available.

Since the day of company foundation we continuously engaged in researching special and high precision printed circuit boards with the strong production capability of 2 to 28 layers of highly precise impedence,multi-layer blind buried,multi-layer mix-compression,high TG, copper substrate,Ceramic substrate PCB. We emphasize the significance of traning program for every single staff in the company even grass-roots employees which becomes the most competitive factors to excel from others,our company have many experienced and professional teams from management to production line,30% are highly educated among the total amount of employees,advanced engineers and senior technicians are up to 80 people.

With advanced foreign technology supports and domestic 3G/4G device manufacturer in microwave pcb field which lead our experienced hi-frequency researching team to one step ahead of the line of printed circuit board business,we are honored to obtain sound reputations over our worldwide customers on the basis of fine qulity,prompt delivery,satisfied after sales service for may years and we assure our customers that we will return the favors with more and more superior products in the near future.